This is where E6’s Cu-diamond composite comes into play. According to the company, its thermal conductivity is in the 800 W/mk range – about twice as high as copper, but not quite as high as diamond on its own.

Don’t expect to see this tech show up in consumer-grade hardware, at least not anytime soon. E6 expects the first applications to utilize the material to include high-end chips for AI processing, RF power amplifiers for wireless and defense communications, and powerful semiconductor lasers.